|
一、General Information
Thermal class:H (180℃)
Polyimide film displays good resistance to solvents and their radio,water,freon,acid
and other chemicals.It's widely used in electrical and machinery
insulation,also can be used for film adhesives and composites base.
二、Technical Requirement
|
Name
|
Unit
|
Index
|
|
appearance
|
|
Transparent and semitransparent
gold film smooth surface, no pinhole,blister & electric
impurity
|
| Specification |
Thickness(tolerance)
|
Mm
|
0.02-0.03
(±0.003)
|
0.031-0.04
(±0.004)
|
0.041-0.16
(±0.005)
|
|
Width
|
Mm
|
6-1000
|
As left
|
As left
|
|
Length
|
Mm
|
≥65
|
≥50
|
≥70
|
|
Tensile strength
Longitudinal
Transverse
|
MPa
|
≥115
≥135
|
|
Elongation at break
Longitudinal
Transverse
|
%
|
≥25
≥20
|
|
Breakdown strength
Normal
-------- 200±5℃
|
MV/m
|
≥130
≥100
|
|
Surface resistivity
Normal
-------- 200±5℃
|
MΩ
|
≥1.0×106
|
|
Volume resistivity
|
MΩ.m
|
≥1.0×107
≥1.0×104
|
|
Dielectric coefficient(50
Hz)
|
|
≤0.01
|
|
Dielectric loss angle tangent
|
|
≤4
|
|
